Multilayer HDI PCB-FPGA Development Board Core Board

B1006

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HDI circuit boards, also known as High Density Interconnects, are advanced printed circuit boards characterized by their high line density and complexity. These boards facilitate high-speed signal transmission and reliability design, making them ideal for use in mobile phones, computers, network communication devices, and automotive electronics. They feature multi-layer circuits, thin plates, small apertures, dense wiring, and micro circuits, all of which enable them to execute several functions while ensuring mutual insulation.

Multilayer circuit boards, on the other hand, are printed boards comprising several layers of insulating substrates and connecting wires alongside solder pads. With their unique insulating properties, these boards conduct circuits on each layer, while providing mutual insulation. Taking Huawei MateBook X and Win10 as examples, HDI boards are typically produced using the stacking method, which involves using multiple layers to increase the board's technical level. Higher-order HDIs employ advanced PCB technologies such as hole stacking, electroplating filling, and laser direct drilling to achieve more than 2 layers. When the density of the PCBs exceeds eight layers, using HDI technology results in lower manufacturing costs compared to traditional complex pressing processes.

BGABOARD available in stock：

Panasonic

R1755V MEGTRON8,R-5795(U), R-5795(N) MEGTRON7,R-5785(N), R-5785(GN), R-5785(GE), R-5785(R) Halogen-free MEGTRON6,R-5375(N), R-5375(E) MEGTRON6,R-5775(N),R-5775(K),R-5775(G),R-5775(S),R-5775(R) MEGTRON4S, MEGTRON4,R-5725S, R-5725 MEGTRON M,R-5735 Halogen-free MEGTRON2,R-1577, R-1577E HIPER V,R-1755V

ITEQ

IT-158,IT-180A,IT-150DA,IT170GT ,IT-858GTC,IT-180GNBS,IT-180ITC,IT-180ATC,IT-189TC,IT-180TC,IT-170GTTC,IT-170GRA1TC,IT-958GTC,IT-170GRA2TC,IT-200LKTC,IT-150DATC,IT-170GLETC,IT-988GTC,IT-968TC,IT-968SETC,IT-988GSETC,IT-968G,IT-8338G,IT-8350G,IT-88GMW,IT-8350B,IT-8350T,IT-8300GA,IT-8615G,IT-258GA3TC,IT-158TC,IT-150GSTC,IT-150GTC,IT-168G1TC,IT-168G2TC,IT-150GXTC,IT-859GTA ,HIPER D,R-1755D,HIPER M,R-1755M ,HIPER E,R-1755E

SHENGYI

S1000H, S1000-2, S1150G, S1170G, S1600L, S1000, S1155, S1000H, S1000-2 ,S1000-2M, S1190, S1165 ,S1141, SDI03KSDI06K,Q100C,S1130 S1141150, S1600, Q160, S3110, S3116, Q360G ,S2130/S2130JB, S2131/S2131JB, S2126 ,S2600F ,S2155G, Q260 ,ST210G ,S1151G ,Autolad1, Autolad3, Autolad2G ,Autolad2GH ,Autolad3G

How to Make FPGA PCB Well?

1.You will receive a circular BGA PCB.PCB BGABOARD focuses on the manufacturing of BGA boards, and each BGA will be made full and round. The circular BGA you designed will be restored to a PCB circular BGA PCB by us. A circular BGA will facilitate SMD, and the PCB board after SMD will achieve a 100% yield rate.
2.Your PCB board impedance will be controlled within plus or minus 8%. For multi-layer BGA, the export wiring rules involve wiring trajectories through multiple rows of pins, some of which may carry high-speed signals, and we will be able to control the impedance within plus or minus 8%.

3.Your HDI (High Density Interconnect) board will be produced at a high level of craftsmanship. As the pin spacing decreases, the required wiring width to reach each layer of BGA between pins will become smaller and smaller. For controlled impedance signals, this means that you will need thinner laminates and ultimately HDI technology. HDI boards are BGABOARD's advantageous process and have extensive experience in the following processes: Depth control drill POFV, resin plug hole plate, (Any layer HDI), POFV (VIPPO) blind/bored hole plate, plate over filled via.

Why can we make BGA high multilayer PCB boards? This is because of our years of production experience, strict data processing, high-end processing equipment, and comprehensive shipment testing, which enable each PCB to meet the most perfect standards.